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Quick Details

  • Place of Origin: China (Mainland)
  • Brand Name: wdf
  • Model Number: wdf-1
  • Base Material: FR4/ROGERS/PET/HDI/CEM/PI
  • Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ
  • Board Thickness: 1.6mm
  • Min. Hole Size: 0.3mm
  • Min. Line Width: 0.12mm
  • Min. Line Spacing: 0.12mm
  • Surface Finishing: HASL-LF
  • Solder mask color: green/red/blue and other
  • PCB test: e-test,x-ray,AOI
  • PCBA test: function test based on requirement
  • Programming: Available
  • Certificatiom: UL, ISO
  • Price: exw factory price

Packaging & Delivery

Packaging Details Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing.
Delivery Time Based on detaile PCB or PCBA
Advantages

No MOQ

- OEM services provided

- Heavy copper PCB, Heavy gold PCB, Blind / Buried via PCB, High layer count PCB  manufacturable

- Factory direct price

- Replying with price in one working day

- Shipping within 24 hours

- Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free

 

 

PCB Capacity
PCB General Capability
Number of Layer1 - 20 Layer
Maximum Processing Area680 × 1000MM
Min Board Thickness2 Layer - 0.3MM ( 12 mil )
4 Layer - 0.4MM ( 16 mil )
6 Layer - 0.8MM ( 32 mil )
8 Layer - 1.0MM ( 40 mil)
10 Layer - 1.1MM ( 44 mil )
12 Layer - 1.3MM ( 52 mil )
14 Layer - 1.5MM ( 59 mil )
16 Layer - 1.6MM ( 63 mil )
18 Layer - 1.8MM ( 71 mil )
Finished Board Thickness ToleranceThickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending≤ 0.75%, Min: 0.5%
Range of TG130 - 215 ℃
Impedance Tolerance± 10%, Min: ± 5%
Hi-Pot TestMax: 4000V/10MA/60S
Surface TreatmentHASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP
PCB Cu Thickness + Plating
Out Layer Cu Thickness1 - 6OZ
Inner Layer Cu Thickness0.5 - 4OZ
Cu Thickness of PTH20UM ≤ Average ≤ 25UM
Min: 18UM
HASL with LeadTin 63% Lead 37%
HASL Free Lead7UM ≤ Surface Thickness ≤ 12UM
Thick Gold PlatingNi Thickness: 3 - 5UM ( 120u" - 200u" )
Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" )
Immersion GoldNi Thckness: 3 - 5UM ( 120u" - 200u" )
Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" )
Immersion SilverAg Thickness: 0.15- 0.75 UM ( 6u" - 30u" )
Gold FingerNi Thickness: 3 - 5UM ( 120u" - 160u" )
Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" )
U940 PCB Pattern Limit Capability 
Min Width0.075MM ( 3 mil )
Min Trace0.075MM ( 3 mil )
Min Width of Ring ( Inner Layer )0.15MM ( 6 mil )
Min Width of Ring ( Out Layer )0.1MM ( 4 mil )
Min Solder Bridge0.1MM ( 4 mil )
Min Height of Legend0.7MM ( 28 mil )
Min Width of Legend0.15MM ( 6 mil )
PCB Holes Processing Capability
Final Hole SizeMin: Laser 0.1MM, Machine 0.2MM
Drilling Hole Size0.10 - 6.5MM
Drilling ToleranceNPTH: ±0.05MM, PTH: ±0.075MM
Final Hole Size Tolerance ( PTH )φ0.20 - 1.60MM ± 0.075MM

φ1.60 - 6.30MM ± 0.10MM

Final Hole Size Tolerance ( NPTH )φ0.20 - 1.60MM ± 0.05MM
φ1.60 - 6.50MM ± 0.05MM
Drilling Strip Hole-0L ~tu.'gth /width 2:1
Min Strip Hole Width 0.65MM
Length & Width Tolerance ± 0.05MM
Board Thickness / Hole Size≤ 10:1
PCB Cover Thickness Capability
Solder Mask ColorGreen,Matte Green,Yellow,Blue,Red,Black,Matte Black,White
Solder Mask ThicknessSurface Line ≥ 10UM
Surface Line Corner ≥ 6UM
Surface Board 10 - 25UM
Solder Mask Bridge Width
Legend ColorWhite,Yellow,Black
Min Height of Legend0.70MM ( 28 mil )
Min Width of Legend0.15MM ( 6 mil )
Blue Gel Thickness0.2 - 1.5MM
Blue Gel Tolerance±0.15MM
Carbon Print Thickness5 - 25UM
Carbon Print Min Space0.25MM
Carbon Print Impedance200Ω
Blind/Burried/Half Via PCB Capability 
Parameters

(1+1)e.g.

(4-layer)blind via:1-2,2-4

(6-layer)buried via:2-3,3-4

(8-layer)blind/buried:1-3,4-5,6-8

Min ViaLaser 0.1MM, Machine 0.2MM
Half ViaMin: 0.6MM
Impedance Capability
Resistance ValueSingle-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω
PCBA Capability

Our PCBA Capability

SMT, PTH, mixed technology

SMT: 2,000,000 solder joints per day

DIP: 300,000 joints per day

Ultra fine pitch, QFP, BGA, μBGA, CBGA

Advanced SMT assembly

Automated insertion of PTH (axial, radial, dip)

Cleanable, aqueous and lead-free processing

RF manufacturing expertise

Peripheral process capabilities

Pressfit back planes & mid planes

Device programming

Automated conformal coating

For E-Test

Universal Tester

Flying Probe Open/Short Tester

High power Microscope

Solder ability Testing Kit

Peel Strength tester

High Volt Open & Short tester

Cross Section Molding Kit With Polisher

If you need PCB assembly service as well, could you give us following information? 
1.Gerber file of the bare PCB board
2.BOM(Bill of material) for assembly
To short the Lead time, please kindly advise us if there is any acceptable components substitution.
3.Testing Guide & Test Fixtures, if necessary
4.Programming files & Programming tool, is necessary
5.Schematic, if necessary

Our Production Capability for PCB

Number of Layer1 - 20 Layer
Maximum Processing Area680 × 1000MM
Min Board Thickness2 Layer - 0.3MM ( 12 mil )
4 Layer - 0.4MM ( 16 mil )
6 Layer - 0.8MM ( 32 mil )
8 Layer - 1.0MM ( 40 mil)
10 Layer - 1.1MM ( 44 mil )
12 Layer - 1.3MM ( 52 mil )
14 Layer - 1.5MM ( 59 mil )
16 Layer - 1.6MM ( 63 mil )
18 Layer - 1.8MM ( 71 mil )
Finished Board Thickness ToleranceThickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending≤ 0.75%, Min: 0.5%
Range of TG130 - 215 ℃
Impedance Tolerance± 10%, Min: ± 5%
Hi-Pot TestMax: 4000V/10MA/60S
Surface TreatmentHASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP

We provide OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

Prompt Response

Contact us to check out full details, we will reply to you with prices in one working day!

Packaging

 

About Us

1.Which type of PCBs do you expert in?

We are specialized in producing HDI multilayer blind, BGA, impedance, half-hole, double-sided, single-sided, etc.

2.Experience?

We are OEM PCB manufacturer with nearly 20 years' experience.

3.What is your Lead time?

Lead time is based on quantity

4.What is your testing policy and how do you control the quality?

For sample,flying probe test. For order>3 square meters,  fixture test, which is faster. There’re many steps for PCB production, we usually do inspection for each step.

5.What ertificate do you have?

ISO9001, ISO14001, UL, RoHS report. We can provide the report of raw material based on customer’s requirement.

6.What is your package?

With Inner vacuum package and carton outside.

7.PCB shipment?

We have shipping agent, cost will be much better.

8.What is your produce ability?

Average 40,000 square meters per month.

9.I only have the pcb sample, not pcb file, can you produce it for me?

Yes, we can design gerberfile based on your sample, and manufacture for you with the gerber.

10.What material brand you use for your PCB?

KB, SL, NANYA, TACONIC, ROGERS etc.

11.What is your MOQ?

No limitation on MOQ.  Prototype, small order and large order are all available.

12.What is the largest size can you fabricate?

27”*20”(686*508mm)

Comparison of Competing Products

Num.Material TechnologyOur ProductionGeneral Production
1Regular/Special

1.Our (TG170)FR4:

high quality materials, excellent heat resistance, won't distort break in high temperature, no foaming, no burning, good performance in electrical charge, impact resistance, humidity-resistance

 

2.Our FR4

good performance in electrical charge, impact resistance, humidity-resistance

 

3.Our CEM

no-burr

 

4.Our Rogers

Good performance in high frequency

 

5.Our Aluminum

Excellent heat dispersion

1.General FR4

High heat work

 

2.General CEM

Expand and deform in damp conditions

2FactoryWe have automatic production line. The automatic production line improves the precision and efficiency of PCB producing,it makes surface brighter, cleaner and more smooth, and it helps reduce the cost.Artificial production line
3Blind/buried via board, High Density Interconnect(1+1,N+1)Application of HDI technology reducing the thickness and the volume of PCB boards, increasing the density of 3-D wiring design.Difficult manufacturer, high cost
4ImpedanceGood performance in reliability and stability of signal sending and receivingHigh cost
5Surface Technics

1.IMG:smooth surface, good adhesion, no oxidation under long using

2.gold plating(thick gold:1-50U"):good wear-resistance

3.HASL:better price, not easy oxidation, easy to welding, smooth surface

4.HAL: better price, not easy oxidation, easy to welding

1.IMG:high price

2.Gold plating(thick gold):high price

3.HAL:surface is not flat, not suitable for BAG packaging

6Copper Via/Surface(20-25UM,0.5-60Z)Laser holing: Min 0.1MM, Mechanical holing: Min 0.2MMHard to reach 0.1MM
7Multilayer board(4-20 L),BGA(CPU)

BGA:high density, high performance, multifunctional, increase thermal reliability, good performance in electroheat property, MIN width/space: 3/3MIL

 

Multilayer board:strong microporous, high reliability

Difficult manufacturer,high cost
8TestTo assure quality, avoid wasting after installing and scraping, save cost, save the time of reworkCareless

 

Our Services

Certifications ROHS, UL, ISO9001-2000, ISO14001 

 
Packaging & Shipping

 

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